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| HGTG10N120BND Data Sheet January 2000 File Number 4579.3 35A, 1200V, NPT Series N-Channel IGBT with Anti-Parallel Hyperfast Diode The HGTG10N120BND is a Non-Punch Through (NPT) IGBT design. This is a new member of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor. The IGBT used is the development type TA49290. The Diode used is the development type TA49189. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. Formerly Developmental Type TA49302. Features * 35A, 1200V, TC = 25oC * 1200V Switching SOA Capability * Typical Fall Time. . . . . . . . . . . . . . . . 140ns at TJ = 150oC * Short Circuit Rating * Low Conduction Loss Packaging JEDEC STYLE TO-247 E C G Ordering Information PART NUMBER HGTG10N120BND PACKAGE TO-247 BRAND 10N120BND NOTE: When ordering, use the entire part number. Symbol G E INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000 HGTG10N120BND Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified HGTG10N120BND Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 1200 35 17 80 20 30 55A at 1200V 298 2.38 -55 to 150 260 8 15 UNITS V A A A V V W W/oC oC oC s s CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 840V, TJ = 125oC, RG = 10. Electrical Specifications PARAMETER TC = 25oC, Unless Otherwise Specified SYMBOL BVCES ICES TEST CONDITIONS IC = 250A, VGE = 0V VCE = BVCES TC = 25oC TC = 125oC TC = 150oC TC = 25oC TC = 150oC MIN 1200 6.0 55 TYP 170 2.45 3.7 6.8 10.4 100 130 23 11 165 100 0.85 0.8 MAX 250 2.5 2.7 4.2 250 120 150 26 15 210 140 1.05 1.0 UNITS V A A mA V V V nA A V nC nC ns ns ns ns mJ mJ Collector to Emitter Breakdown Voltage Collector to Emitter Leakage Current Collector to Emitter Saturation Voltage VCE(SAT) IC = 10A, VGE = 15V Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On-State Gate Charge VGE(TH) IGES SSOA VGEP QG(ON) IC = 90A, VCE = VGE VGE = 20V TJ = 150oC, RG = 10, VGE = 15V, L = 400H, VCE(PK) = 1200V IC = 10A, VCE = 0.5 BVCES IC = 10A, VCE = 0.5 BVCES VGE = 15V VGE = 20V Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 3) td(ON)I trI td(OFF)I tfI EON EOFF IGBT and Diode at TJ = 25oC ICE = 10A VCE = 0.8 BVCES VGE = 15V RG = 10 L = 2mH Test Circuit (Figure 20) 2 HGTG10N120BND Electrical Specifications PARAMETER Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 3) Diode Forward Voltage Diode Reverse Recovery Time TC = 25oC, Unless Otherwise Specified (Continued) SYMBOL td(ON)I trI td(OFF)I tfI EON EOFF VEC trr IEC = 10A IEC = 10A, dIEC/dt = 200A/s IEC = 1A, dIEC/dt = 200A/s Thermal Resistance Junction To Case RJC IGBT Diode NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. TEST CONDITIONS IGBT and Diode at TJ = 150oC ICE = 10A VCE = 0.8 BVCES VGE = 15V RG = 10 L = 2mH Test Circuit (Figure 20) MIN TYP 21 11 190 140 1.75 1.1 2.55 57 32 MAX 25 15 250 200 2.3 1.4 3.2 70 40 0.42 1.25 UNITS ns ns ns ns mJ mJ V ns ns oC/W oC/W Typical Performance Curves 35 ICE , DC COLLECTOR CURRENT (A) Unless Otherwise Specified ICE , COLLECTOR TO EMITTER CURRENT (A) VGE = 15V 30 25 20 15 10 5 0 25 50 75 100 125 150 TC , CASE TEMPERATURE (oC) 60 50 TJ = 150oC, RG = 10, VG = 15V, L = 400H 40 30 20 10 0 0 200 400 600 800 1000 1200 1400 VCE , COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA 3 HGTG10N120BND Typical Performance Curves fMAX , OPERATING FREQUENCY (kHz) Unless Otherwise Specified (Continued) tSC , SHORT CIRCUIT WITHSTAND TIME (s) 100 50 VCE = 840V, RG = 10, TJ = 125oC 20 tSC 15 ISC 150 200 TC = 75oC, VGE = 15V, IDEAL DIODE fMAX1 = 0.05 / (td(OFF)I + td(ON)I) 10 fMAX2 = (PD - PC) / (EON + EOFF) TC PC = CONDUCTION DISSIPATION 75oC (DUTY FACTOR = 50%) 75oC 110oC ROJC = 0.42oC/W, SEE NOTES 110oC 1 2 5 10 20 ICE , COLLECTOR TO EMITTER CURRENT (A) VGE 15V 12V 15V 12V 10 100 5 12 13 14 15 16 50 VGE , GATE TO EMITTER VOLTAGE (V) FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT FIGURE 4. SHORT CIRCUIT WITHSTAND TIME ICE, COLLECTOR TO EMITTER CURRENT (A) 50 DUTY CYCLE <0.5%, VGE = 12V PULSE DURATION = 250s 40 ICE, COLLECTOR TO EMITTER CURRENT (A) 50 TC = -55oC 40 TC = 25oC 30 TC = -55oC 20 TC = 25oC 30 TC = 150oC 20 TC = 150oC 10 10 DUTY CYCLE <0.5%, VGE = 15V PULSE DURATION = 250s 0 0 2 4 6 8 10 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 0 0 2 4 6 8 10 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE 5 EOFF, TURN-OFF ENERGY LOSS (mJ) EON , TURN-ON ENERGY LOSS (mJ) RG = 10, L = 2mH, VCE = 960V 4 TJ = 150oC, VGE = 12V, VGE = 15V 3 2.0 RG = 10, L = 2mH, VCE = 960V 1.5 TJ = 150oC, VGE = 12V OR 15V 1.0 TJ = 25oC, VGE = 12V OR 15V 0.5 2 1 TJ = 25oC, VGE = 12V, VGE = 15V 0 0 5 10 15 20 0 0 5 10 15 ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT 4 ISC, PEAK SHORT CIRCUIT CURRENT (A) 20 TJ = 150oC, RG = 10, L = 2mH, V CE = 960V 25 250 HGTG10N120BND Typical Performance Curves 40 tdI , TURN-ON DELAY TIME (ns) RG = 10, L = 2mH, VCE = 960V TJ = 25oC, TJ = 150oC, VGE = 12V 35 trI , RISE TIME (ns) 40 Unless Otherwise Specified (Continued) 50 RG = 10, L = 2mH, VCE = 960V TJ = 25oC, TJ = 150oC, VGE = 12V 30 30 25 20 20 TJ = 25oC, TJ = 150oC, VGE = 15V 15 0 5 10 15 20 10 TJ = 25oC OR TJ = 150oC, VGE = 15V 0 0 5 10 15 20 ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT 400 td(OFF)I , TURN-OFF DELAY TIME (ns) RG = 10, L = 2mH, VCE = 960V 350 300 250 200 150 100 tfI , FALL TIME (ns) 300 RG = 10, L = 2mH, VCE = 960V 250 VGE = 12V, VGE = 15V, TJ = 150oC 200 TJ = 150oC, VGE = 12V OR 15V 150 100 VGE = 12V, VGE = 15V, TJ = 25oC 50 0 5 10 15 20 0 5 10 15 20 ICE , COLLECTOR TO EMITTER CURRENT (A) TJ = 25oC, VGE = 12V OR 15V ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT ICE , COLLECTOR TO EMITTER CURRENT (A) 100 VGE, GATE TO EMITTER VOLTAGE (V) DUTY CYCLE <0.5%, VCE = 20V PULSE DURATION = 250s 80 20 IG (REF) = 1mA, RL = 60, TC = 25oC 15 VCE = 1200V VCE = 800V 60 10 VCE = 400V 5 40 TC = 25oC TC = 150oC 20 TC = -55oC 10 11 12 13 14 15 0 7 8 9 0 0 20 40 60 80 100 120 VGE , GATE TO EMITTER VOLTAGE (V) QG , GATE CHARGE (nC) FIGURE 13. TRANSFER CHARACTERISTIC FIGURE 14. GATE CHARGE WAVEFORMS 5 HGTG10N120BND Typical Performance Curves 4 FREQUENCY = 1MHz Unless Otherwise Specified (Continued) ICE, COLLECTOR TO EMITTER CURRENT (A) 15 DUTY CYCLE <0.5%, TC = 110oC PULSE DURATION = 250s C, CAPACITANCE (nF) 3 CIES 2 12 VGE = 15V 9 VGE = 10V 6 1 CRES COES 3 0 0 5 10 15 20 25 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 0 0 1 2 3 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE FIGURE 16. COLLECTOR TO EMITTER ON-STATE VOLTAGE ZJC , NORMALIZED THERMAL RESPONSE 100 0.5 0.2 0.1 10-1 0.05 0.02 0.01 10-2 10-5 SINGLE PULSE 10-4 10-3 DUTY FACTOR, D = t1 / t2 PD PEAK TJ = (PD X ZJC X RJC) + TC 10-2 10-1 t1 t2 100 t1 , RECTANGULAR PULSE DURATION (s) FIGURE 17. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE 70 IF, FORWARD CURRENT (A) 100 t, RECOVERY TIMES (ns) 60 50 40 30 TC = 25oC, dIEC / dt = 200A/s 150oC 10 trr ta 20 10 tb 1 2 5 IF, FORWARD CURRENT (A) 10 20 25oC -55oC 1 1 2 3 4 5 6 VF , FORWARD VOLTAGE (V) FIGURE 18. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP FIGURE 19. RECOVERY TIMES vs FORWARD CURRENT 6 HGTG10N120BND Test Circuit and Waveforms HGTG10N120BND 90% VGE EOFF L = 2mH RG = 10 + ICE VDD = 960V 10% td(OFF)I tfI trI td(ON)I VCE 90% 10% EON - FIGURE 20. INDUCTIVE SWITCHING TEST CIRCUIT FIGURE 21. SWITCHING TEST WAVEFORMS Handling Precautions for IGBTs Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler's body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as "ECCOSORBDTM LD26" or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-circuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended. Operating Frequency Information Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2 ; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 21. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM . td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC. The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0). All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 7 ECCOSORBD is a Trademark of Emerson and Cumming, Inc. |
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